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NCP562, NCP563 80 mA CMOS Low Iq Low-Dropout Voltage Regulator
This series of fixed output low-dropout linear regulators are designed for handheld communication equipment and portable battery powered applications which require low quiescent. This series features an ultra-low quiescent current of 2.5 A. Each device contains a voltage reference unit, an error amplifier, a PMOS power transistor, resistors for setting output voltage, current limit, and temperature limit protection circuits. The NCP562 series provides an enable pin for ON/OFF control. The NCP562 has been designed to be used with low cost ceramic capacitors and requires a minimum output capacitor of 0.1 F. The device is housed in the micro-miniature SC82-AB surface mount package. Standard voltage versions are 1.5, 1.8, 2.5, 2.7, 2.8, 3.0, 3.3, and 5.0 V. Other voltages are available in 100 mV steps.
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1 SC82-AB (SC70-4) SQ SUFFIX CASE 419C
* * * * *
Low Quiescent Current of 2.5 A Typical Low Output Voltage Option Output Voltage Accuracy of 2.0% Temperature Range of -40C to 85C NCP562 Provides an Enable Pin
PIN CONNECTIONS & MARKING DIAGRAMS
Gnd 1 xxxM Vin 2
4 Enable
3 Vout
Typical Applications
* Battery Powered Instruments * Hand-Held Instruments * Camcorders and Cameras
ON Gnd Input Vin C1 + Vout + C2 Enable OFF Output
(NCP562 Top View)
Gnd 1 xxxM Vin 2
4 N/C
3 Vout
(NCP563 Top View) xxx M = Device Code = Date Code
This device contains 28 active transistors
Figure 1. NCP562 Typical Application Diagram
Gnd Input Vin C1 + Vout + C2 N/C Output
ORDERING INFORMATION
See detailed ordering and shipping information in the package dimensions section on page 9 of this data sheet.
This device contains 28 active transistors
Figure 2. NCP563 Typical Application Diagram
(c) Semiconductor Components Industries, LLC, 2002
1
January, 2002 - Rev. 1
Publication Order Number: NCP562/D
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MAXIMUM RATINGS
Lead Soldering Temperature @ 260C Storage Temperature Operating Ambient Temperature Operating Junction Temperature Power Dissipation and Thermal Characteristics Power Dissipation Thermal Resistance, Junction to Ambient Output Voltage Enable Voltage (NCP562 ONLY) Input Voltage - 4 N/C Rating No internal connection. Symbol Enable Tsolder PD RJA Vout Tstg Vin TA TJ Internally Limited 400 -0.3 to Vin +0.3 -0.3 to Vin +0.3 -55 to +150 -40 to +85 Value +125 6.0 10 W C/W Unit sec C C C V V V
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PIN FUNCTION DESCRIPTION
NCP562 4 3 2 1 NCP563 - 3 2 1 Pin Name Enable Vout Gnd Vin This input is used to place the device into low-power standby. When this input is pulled low, the device is disabled. If this function is not used, Enable should be connected to Vin. Regulated output voltage. Positive power supply input voltage. Power supply ground.
1. This device series contains ESD protection and exceeds the following tests: Human Body Model 2000 V per MIL-STD-883, Method 3015 Machine Model Method 200 V 2. Latch up capability (85C) "100 mA DC with trigger voltage.
NCP562, NCP563
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ELECTRICAL CHARACTERISTICS
(Vin = Vout(nom.) + 1.0 V, Venable = Vin, Cin = 1.0 F, Cout = 1.0 F, TJ = 25C, unless otherwise noted.) Characteristic Output Voltage (TA = 25C, Iout = 1.0 mA) 1.5 V 1.8 V 2.5 V 2.7 V 2.8 V 3.0 V 3.3 V 5.0 V Line Regulation 1.5 V-4.4 V (Vin = Vo(nom.) + 1.0 V to 6.0 V 4.5 V-5.0 V (Vin = 5.5 V to 6.0 V) Load Regulation (Iout = 10 mA to 80 mA) Output Current (Vout = (Vout at Iout = 80 mA) -3.0%) 1.5 V to 3.9 V (Vin = Vout(nom.) + 2.0 V) 4.0 V-5.0 V (Vin = 6.0 V) Dropout Voltage (TA = -40C to 85C, Iout = 80 mA, Measured at Vout -3.0%) 1.5 V-1.7 V 1.8 V-2.4 V 2.5 V-2.6 V 2.7 V-2.9 V 3.0 V-3.2 V 3.3 V-4.9 V 5.0 V Quiescent Current (Enable Input = 0 V) (Enable Input = Vin, Iout = 1.0 mA to Io(nom.)) Output Short Circuit Current 1.5 V to 3.9 V (Vin = Vnom + 2.0 V) 4.0 V-5.0 V (Vin = 6.0 V) Output Voltage Noise (f = 100 Hz to 100 kHz, Vout = 3.0 V) Enable Input Threshold Voltage (NCP562 ONLY) (Voltage Increasing, Output Turns On, Logic High) (Voltage Decreasing, Output Turns Off, Logic Low) Output Voltage Temperature Coefficient 3. Maximum package power dissipation limits must be observed. T *TA PD + J(max) RqJA 4. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible. Symbol Vout 1.455 1.746 2.425 2.646 2.744 2.940 3.234 4.9 Regline - - Regload Io(nom.) 80 80 Vin-Vout - - - - - - - IQ - - Iout(max) 600 150 Vn Vth(en) 1.3 - TC - - - "100 - 0.3 - ppm/C - 300 300 100 600 600 - Vrms V 0.1 2.5 1.0 6.0 mA 550 400 250 230 200 190 140 800 550 400 400 350 350 250 A 280 280 - - mV - 10 10 20 20 20 40 mV mA 1.5 1.8 2.5 2.7 2.8 3.0 3.3 5.0 1.545 1.854 2.575 2.754 2.856 3.060 3.366 5.1 mV Min Typ Max Unit V
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2.9 IQ, QUIESCENT CURRENT (mA) IQ, QUIESCENT CURRENT (mA) 2.7 2.5 2.3 2.1 1.9 1.7 -60 VIN = 4.0 V VOUT = 3.0 V IOUT = 0 mA 3 2.5 2 1.5 1 0.5 0 -40 -20 0 20 40 60 80 100 0 1 2 3 4 5 6 T, TEMPERATURE (C) VIN, INPUT VOLTAGE (V) VOUT = 3.0 V
Figure 3. Quiescent Current versus Temperature
Figure 4. Quiescent Current versus Input Voltage
3.5 VOUT, OUTPUT VOLTAGE (V) 3 IOUT = 30 mA 2.5 2 1.5 1 0.5 0 0 1 2 3 4 5 6
3.020 VOUT, OUTPUT VOLTAGE (V) 3.015 VIN = 6.0 V 3.010 3.005 3.000 2.995 2.990 -60 VOUT(nom) = 3.0 V IOUT = 10 mA -40 -20 0 20 40 VIN = 4.0 V
60
80
100
T, TEMPERATURE (C)
VIN, INPUT VOLTAGE (V)
Figure 5. Output Voltage versus Temperature
Figure 6. Output Voltage versus Input Voltage
VIN - VOUT, DROPOUT VOLTAGE (mV)
VOUT(nom) = 3.0 V 250 80 mA LOAD 200 150
ENABLE VOLTAGE (V)
300
4 2 0 3 VOUT, OUTPUT VOLTAGE (V) 40 mA LOAD 2 1 0 0 50 100 150 200 250 300 350 400 t, TIME (ms) COUT = 0.1 mF IOUT = 10 mA VIN = 4.0 V CIN = 1.0 mF
100 50 0 -50 -25 0 25 50 75 T, TEMPERATURE (C)
10 mA LOAD 100 125
Figure 7. Dropout Voltage versus Temperature
Figure 8. Turn-On Response (NCP562 ONLY)
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IOUT, OUTPUT CURRENT (mA) VIN, INPUT VOLTAGE (V) 6 5 4 3 1 0.5 0 -0.5 -1 0 50 VOUT = 3.0 V COUT = 0.1 mF IOUT = 10 mA 100 150 200 250 300 350 400 t, TIME (ms) 60 30 0 -30 1 0.5 0 -0.5 -1 0 50 100 150 200 250 300 350 400 t, TIME (ms) 450 500 VOUT = 3.0 V COUT = 0.1 mF IOUT = 1 mA to 30 mA VIN = 4.0 V
OUTPUT VOLTAGE DEVIATION (V)
450 500
Figure 9. Line Transient Response
OUTPUT VOLTAGE DEVIATION (mV)
Figure 10. Load Transient Response
Vn, OUTPUT VOLTAGE NOISE (mV/Hz)
3.5 3 2.5 2 1.5 1 0.5 0 0.01 0.1 1 10 100 1000 f, FREQUENCY (kHz) VIN = 5.0 V VOUT = 3.0 V IOUT = 50 mA COUT = 0.1 mF
Figure 11. Output Voltage Noise
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DEFINITIONS
Load Regulation Line Regulation
The change in output voltage for a change in output current at a constant temperature.
Dropout Voltage
The input/output differential at which the regulator output no longer maintains regulation against further reductions in input voltage. Measured when the output drops 3.0% below its nominal. The junction temperature, load current, and minimum input supply requirements affect the dropout level.
Maximum Power Dissipation
The change in output voltage for a change in input voltage. The measurement is made under conditions of low dissipation or by using pulse technique such that the average chip temperature is not significantly affected.
Line Transient Response
Typical over and undershoot response when input voltage is excited with a given slope.
Thermal Protection
The maximum total dissipation for which the regulator will operate within its specifications.
Quiescent Current
The quiescent current is the current which flows through the ground when the LDO operates without a load on its output: internal IC operation, bias, etc. When the LDO becomes loaded, this term is called the Ground current. It is actually the difference between the input current (measured through the LDO input pin) and the output current.
Internal thermal shutdown circuitry is provided to protect the integrated circuit in the event that the maximum junction temperature is exceeded. When activated at typically 160C, the regulator turns off. This feature is provided to prevent failures from accidental overheating.
Maximum Package Power Dissipation
The maximum power package dissipation is the power dissipation level at which the junction temperature reaches its maximum operating value, i.e. 125C. Depending on the ambient power dissipation and thus the maximum available output current.
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APPLICATIONS INFORMATION A typical application circuit for the NCP562 and NCP563 series are shown in Figure 1 and Figure 2.
Input Decoupling (C1)
Place external components, especially the output capacitor, as close as possible to the circuit, and make leads as short as possible.
Thermal
A 1.0 F capacitor either ceramic or tantalum is recommended and should be connected close to the NCP562 package. Higher values and lower ESR will improve the overall line transient response. TDK capacitor: C2012X5R1C105K, or C1608X5R1A105K The NCP562 and NCP563 are very stable regulators and do not require any specific Equivalent Series Resistance (ESR) or a minimum output current. Capacitors exhibiting ESRs ranging from a few m up to 10 can thus safely be used. The minimum decoupling value is 0.1 F and can be augmented to fulfill stringent load transient requirements. The regulator accepts ceramic chip capacitors as well as tantalum devices. Larger values improve noise rejection and load regulation transient response. TDK capacitor: C2012X5R1C105K, C1608X5R1A105K, or C3216X7R1C105K
Output Decoupling (C2)
As power across the NCP562 and NCP563 increases, it might become necessary to provide some thermal relief. The maximum power dissipation supported by the device is dependent upon board design and layout. Mounting pad configuration on the PCB, the board material and also the ambient temperature effect the rate of temperature rise for the part. This is stating that when the devices have good thermal conductivity through the PCB, the junction temperature will be relatively low with high power dissipation applications. The maximum dissipation the package can handle is given by:
T *TA PD + J(max) RqJA
Enable Operation (NCP562 ONLY)
The enable pin will turn on the regulator when pulled high and turn off the regulator when pulled low. These limits of threshold are covered in the electrical specification section of this data sheet. If the enable is not used, then the pin should be connected to Vin.
Hints
If junction temperature is not allowed above the maximum 125C, then the NCP562 and NCP563 can dissipate up to 250 mW @ 25C. The power dissipated by the NCP562 and NCP563 can be calculated from the following equation:
Ptot + [Vin * Ignd (Iout)] ) [Vin * Vout] * Iout
or
P ) Vout * Iout VinMAX + tot Ignd ) Iout
Please be sure the Vin and Gnd lines are sufficiently wide. When the impedance of these lines is high, there is a chance to pick up noise or cause the regulator to malfunction.
If an 80 mA output current is needed then the ground current from the data sheet is 2.5 A. For an NCP562 or NCP563 (3.0 V), the maximum input voltage will then be 6.0 V.
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MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure proper solder connection
0.60 0.80
interface between the board and the package. With the correct pad geometry, the packages will self align when subjected to a solder reflow process.
0.60
0.60
0.80
1.90
0.80 1.30
mm
SC-82AB (SC70-4)
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ORDERING INFORMATION
Device NCP562SQ15T1 NCP562SQ18T1 NCP562SQ25T1 NCP562SQ27T1 NCP562SQ28T1 NCP562SQ30T1 NCP562SQ33T1 NCP562SQ50T1 NCP563SQ15T1 NCP563SQ18T1 NCP563SQ25T1 NCP563SQ27T1 NCP563SQ28T1 NCP563SQ30T1 NCP563SQ33T1 NCP563SQ50T1 Nominal Output Voltage 1.5 1.8 2.5 2.7 2.8 3.0 3.3 5.0 1.5 1.8 2.5 2.7 2.8 3.0 3.3 5.0 Marking LDI LEY LDK LEZ LDL LDM LDN LDP LDQ LFA LDS LFB LDT LDU LDV LDX Package Shipping
SC82-AB
3000 Units/ 8 Tape & Reel 8 Ta e
SC82-AB
3000 Units/ 8 Ta e 8 Tape & Reel
Additional voltages are available upon request by contacting your ON Semiconductor representative.
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PACKAGE DIMENSIONS
SC82-AB (SC70-4) SQ SUFFIX CASE 419C-01 ISSUE A
A G D 3 PL
4 3 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. MILLIMETERS MIN MAX 1.8 2.2 1.15 1.45 0.8 1.1 0.2 0.4 0.3 0.5 1.1 1.5 0.0 0.1 0.10 0.26 0.1 --0.05 BSC 0.7 REF 1.8 2.4 INCHES MIN MAX 0.071 0.087 0.045 0.057 0.031 0.043 0.008 0.016 0.012 0.020 0.043 0.059 0.000 0.004 0.004 0.010 0.004 --0.002 BSC 0.028 REF 0.07 0.09
C N
S
1 2
B
K
F L
H J 0.05 (0.002)
DIM A B C D F G H J K L N S
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Notes
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ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer.
PUBLICATION ORDERING INFORMATION
Literature Fulfillment: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: ONlit@hibbertco.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada JAPAN: ON Semiconductor, Japan Customer Focus Center 4-32-1 Nishi-Gotanda, Shinagawa-ku, Tokyo, Japan 141-0031 Phone: 81-3-5740-2700 Email: r14525@onsemi.com ON Semiconductor Website: http://onsemi.com For additional information, please contact your local Sales Representative.
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NCP562/D

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